Detailed production process of single crystal and polycrystalline silicon wafers (1) (1)
Starting from the single crystal rod produced in the single crystal furnace, the silicon wafer process is basically started. In order to help everyone understand and understand the detailed production process of silicon materials to silicon wafers, improve the understanding of this industry, in order to better engage in the photovoltaic industry, now some of the production process information is organized as follows, I hope to be helpful to everyone.
The silicon wafer preparation process begins with a silicon single crystal rod and ends with a clean polished sheet to be used in an excellent environment. During this period, there are many processes and cleaning steps from a single crystal silicon rod to processing a number of wafers that meet special requirements. Except for many process steps, the entire process is almost always carried out in a dust-free environment. Wafer processing begins with a relatively dirty environment and is ultimately completed in a level 10 net vacancy.
Process overview
All process steps are summarized into three main categories: ability to modify physical properties such as size, shape, flatness, or performance of some bulk materials; to reduce the amount of undesirable surface damage; or to eliminate surface contamination and particles. The order of the process steps is important because the decision of these steps can minimize the damage to the wafer and reduce the contamination of the wafer.
Wafer processing steps
Slice
2. Laser marking
3. Chamfering
4. Grinding tablets
5. Corrosion
6. Back injury
7. Edge mirror polishing
8. Preheating cleaning
9. Resistance to stability - annealing 10. back seal
11. Sticky film
12. Polishing
13. Cleaning before inspection
14. Visual inspection
15. Metal cleaning
16. Wipe
17. Laser inspection
18. Packaging / Shipping
Slice (class 500k)
In the introduction of wafer processing, the first step from the single crystal silicon rod is to slice. The key to this step is how to minimize the loss when processing a single crystal silicon rod into a silicon wafer, which requires that the single crystal rod be processed as much as possible into a useful silicon wafer. In order to get the best silicon possible, the silicon requires a minimum amount of warpage and a minimum amount of knife loss.
There are two main ways in the slicing process - inner circle cutting and wire cutting. The reason these two forms of cutting are applied is that they minimize material loss, minimize damage to the wafer, and allow wafer warpage to be minimal.
Slicing is a relatively dirty process that can be described as a grinding process that produces large amounts of particles and a large amount of very shallow surface damage.
After the wafer is cut, the bonded carbon plate and the adhesive used to bond the carbon sheets must be removed from the wafer. In this cleaning and cleaning process, it is important to keep the order of the wafers because they are not yet distinguished by the logo.
Laser logo (Class 500k)
After the ingot is cut into a piece of silicon, the wafer is laser engraved. A high-power laser printer is used to engrave the surface of the wafer. The silicon wafers are encoded in the same order as they are cut from the ingot, so that the correct position of the wafer is known. This code should be uniform to identify the silicon chip and know its source. The code can indicate from which position of the single crystal rod the silicon wafer is cut. It is important to maintain such traceability because the overall properties of the single crystal will vary from one end of the ingot to the other. The number needs to be engraved deep enough to remain after the final wafer is polished. After engraving the code on the silicon chip, even if the silicon chip is missing, it can be traced back to the original position, and if the trend is clear, then the correct measures can be taken. The laser marking can be on the front side of the wafer or on the back side, although the front side is usually used.
Chamfer
When the slicing is completed, the silicon wafer has sharper edges and needs to be chamfered to form a bullet-like smooth edge. The chamfered wafer edge has a low center stress, which makes it stronger. The reinforcement of the edge of the wafer enables it to reduce the fragmentation of the wafer during subsequent wafer processing.
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